企业特殊行业经营资质信息公示
Summit 1800i
Semi-Automatic Rework System
The Summit 1800i is the latest in the popular Summitseries. Carrying forward the leading heating capacity,throughput, repeatability, and reliability of the Summit1800, the Summit 1800i offers added performanceand flexibility.
Redesigned component placement provides improvedperformance for micro passive devices and connectors.With up to 80mm Field of View, the Summit 1800i meetsrework need for today and many years to come.
Key Features
• Placement Accuracy – 0.005” (12μ)
• Top Heater – 1.6 kw Convection
• 2.2 kw Top Heater Boost
• Bottom Heater – 4.0 kW Convection
• Optional 7.8 kW Bottom Heater
• Maximum Board
• Standard 18 x 22” (455 x 560 mm)
• Optional 22 x 30” (560 x 760 mm)
The Summit 1800i is the premier Surface MountRework system. It incorporates proven featuresand benefi ts common to all Summit systems plus introduces state-of the-art innovations to address the latest industry advancements and challenges.
Standard Features:
• SierraMate Software with Auto Profi le
• Easy to Use “1-2-3-GO” User Interface
• Independent Heater and Component
Pick-up Motions
• Precise Placement with Programmable Force
• Top Heater Cooling Boost and Active
Component Cooling
• Zero Force Component Removal
• Six User Thermocouple Inputs
Popular Optional Features:
• Programmable Solder Scavenger with Dynamic
Height Sensing
• 22 x 30” Board Support with 7.8 kW
Bottom Heater
• 1000 W Bottom Site Convection Heater
• >80 mm Alignment Field of View
• Component Solder Paste Printing
Summit 750i
半自动返修系统
Summit 750i是为满足那些要求在合理价位基础上实现高性能及**工艺控制需求的用户而特别设计的一款返修系统。Summit 750i吸收了通常只在高价位机型上具备的特性，即享有专利的软件及其自动设置温度曲线功能和易于操作的“1-2-3-Go”图形用户界面，确保了对系统所有光学、机械及热功能*限度的控制。新的750i整合了所有Summit系列的优势和功能，并且引入了*的技术创新，以应对行业的*应用和挑战。带有LCD显示器的高性能电脑与自动控制程序相结合，使Summit 750i真正成为一款“易于使用”的返修系统。
BGA返修
主要参数：
*基板尺寸 455mm*508mm
**小元件尺寸 0201
贴放精度 0.002’(50μ)
符合标准 CE
顶部加热器 1.6kW聚焦对流
底部加热器 4.0kW对流高压
视野 50mm见方
Summit 750i是建立在享誉盛名的Summit平台上的真正的生产系统，可随时安装于生产现场。它具备许多重要特性，可提供独特性能。Summit 750i返修系统具有针对包括BGA在内的各种组件的全套返修性能。 Summit 750i基于声誉卓越的Summit系统而设计。该系统已成为电子组装行业多年来**的表面贴装返修设备。**的顶部及底部对流加热器及专有的裂像功能增强了 软件，并将缺陷区域阵列组件的自动移除和贴放功能发挥得淋漓尽致。可编程的拾取和贴放，自动高度感应及自动设置温度曲线功能使标准Summit 750i成为同类设备中无可匹敌的高性价比选择方案。
