Ti900 导热复合材料
●高电气绝缘●低热阻●容易施工
以聚醯亚胺为基材,常用于需要高电器绝缘之电子产品。
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
物性表
| 物性 | Ti900 | 单位 | 公差 | 测试方法 |
| Thermal Conductivity 导热系数 | 1.9 | W / mK | ±10% | ASTM D5470 |
| Thickness 厚度 | 0.12 | mm | – | ASTM D374 |
| Color 颜色 | Gray灰 | – | – | Visual目视 |
| base 基材 | Polyimide | – | – | – |
| Insulation Strength Vac 耐电压 | 6.1 | KV / mm | – | ASTM D149 |
| Volume resistance 体积阻抗 | >1012 | Ohm-m | – | ASTM D257 |
| Working temperature 工作温度 | -50~+180 | °C | – | – |
| Tensile Strength 抗拉强度 | 5000 | psi | – | ASTM D412 |
| Elongation 延展率 | 40 | % | – | ASTM D412 |
| Flame rating 耐燃等级 | V-0 | – | – | UL 94 |
| Standard Shape标准形状 | Sheet ones单片状 | – | – | – |
| ●符合REACH规范 ●符合RoHS规范 ●符合UL规范 | ||||
●Need samples?样品需求? ●Pre-cut for different shapes可依需求冲型裁切 | ||||
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