苏州迈瑞迪电子科技有限公司Tg135℃技术参数 | |||||||||||
应用领域:电脑,仪器,录像机,通讯设备、消费电子、机械 消费电子、游戏机电子.电工.电器.电气.工程.军工.机器.设备. |
|||||||||||
产品性能 | 产品证书 | 资料下载 | |||||||||
测试项目 | 方法 | 条件 | 单元 | 典型值 | |||||||
Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 140 | |||||||
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 60 | |||||||
After Tg | ppm/℃ | 280 | |||||||||
50-260℃ | % | 3.8 | |||||||||
Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 5.5x107 | |||||||
E-24/125 | 5.7x106 | ||||||||||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 313 | |||||||
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | S | >60 | |||||||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 15 | |||||||
Flexural Strength(LW/CW) | IPC-TM-650 2.4.4 | A | MPa | 550/450 | |||||||
Permittivity (1MHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | ’-- | 4.9 | |||||||
Loss Tangent (1MHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | ‘-- | 0.015 | |||||||
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 5.1x108 | |||||||
E-24/125 | 5.3x106 | ||||||||||
CTI | IEC 60112 | A | Rating | PLC3 | |||||||
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |||||||
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 | |||||||
Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 1.7 | |||||||
Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.1 |
新闻中心